Semiconductor package device and method of manufacturing the same

ABSTRACT

A semiconductor package device includes a transparent carrier, a first patterned conductive layer, a second patterned conductive layer, and a first insulation layer. The transparent carrier has a first surface, a second surface opposite to the first surface and a third surface extended between the first surface and the second surface. The first patterned conductive layer is disposed on the first surface of the transparent carrier. The first patterned conductive layer has a first surface coplanar with the third surface of the transparent carrier. The second patterned conductive layer is disposed on the first surface of the transparent carrier and electrically isolated from the first patterned conductive layer. The first insulation layer is disposed on the transparent carrier and covers the first patterned conductive layer.

BACKGROUND 1. Technical Field

The subject application relates generally to a semiconductor packagedevice, and to a semiconductor package device including a transparentcarrier.

2. Description of the Related Art

A singulation operation, which may include grinding techniques, opticaltechniques (e.g. laser cutting techniques), mechanical techniques (e.g.knife/blade cutting), chemical techniques (e.g. etching techniques), canbe performed on a wafer or panel to manufacture a semiconductor packagedevice. Controlling singulation operations to avoid damage (e.g.cracking, chipping, or other issues) on the wafer or panel or thesemiconductor package device can be challenging. It can be challenging,when an optical technique is used, to manufacture a semiconductorpackage device having transparent materials.

SUMMARY

In one aspect, according to some embodiments, a semiconductor packagedevice includes a transparent carrier, a first patterned conductivelayer, a second patterned conductive layer, and a first insulationlayer. The transparent carrier has a first surface, a second surfaceopposite to the first surface and a third surface extended between thefirst surface and the second surface. The first patterned conductivelayer is disposed on the first surface of the transparent carrier. Thefirst patterned conductive layer has a first surface coplanar with thethird surface of the transparent carrier. The second patternedconductive layer is disposed on the first surface of the transparentcarrier and electrically isolated from the first patterned conductivelayer. The first insulation layer is disposed on the transparent carrierand covers the first patterned conductive layer.

In another aspect, according to some embodiments, a semiconductorpackage device includes a transparent carrier, a first patternedconductive layer, and a first transparent insulation layer. Thetransparent carrier has a first surface, a second surface opposite tothe first surface and a third surface extended between the first surfaceand the second surface. The first patterned conductive layer is disposedon the first surface of the transparent carrier. The first patternedconductive layer has a first surface coplanar with the third surface ofthe transparent carrier. The first transparent insulation layer isdisposed on the transparent carrier and covers the first patternedconductive layer.

In yet another aspect, according to some embodiments, a method ofmanufacturing a semiconductor package device includes forming apatterned conductive layer on a scribe line of a transparent carrier;forming a trench through the patterned conductive layer and into thetransparent carrier by a dicing operation along the scribe line;grinding the transparent carrier at a second surface of the transparentcarrier facing away from the patterned conductive layer to form aplurality of singulated transparent carrier units; attaching theplurality of singulated transparent carrier units to an adhesive layer;and singulating the adhesive layer by a laser operation. An alignment ofthe laser operation is based on the patterned conductive layer.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the subject application are readily understood from thefollowing detailed description when read with the accompanying drawings.It is noted that various features may not be drawn to scale, and thedimensions of the depicted features in the drawings may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1A illustrates a cross-sectional view of a semiconductor packagedevice in accordance with some embodiments of the subject application.

FIG. 1B illustrates a cross-sectional view of a semiconductor packagedevice in accordance with some embodiments of the subject application.

FIG. 2A illustrates a cross-sectional view of a semiconductor packagedevice in accordance with some embodiments of the subject application.

FIG. 2B illustrates a cross-sectional view of a semiconductor packagedevice in accordance with some embodiments of the subject application.

FIG. 3A, FIG. 3B, FIG. 3C, FIG. 3D, FIG. 3E, FIG. 3F, FIG. 3G, FIG. 3H,FIG. 3I and FIG. 3J show operations for manufacturing a semiconductorpackage device in accordance with some embodiments of the subjectapplication.

FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4F, FIG. 4G, FIG. 4H,FIG. 4I and FIG. 4J show operations for manufacturing a semiconductorpackage device in accordance with some embodiments of the subjectapplication.

Common reference numerals are used throughout the drawings and thedetailed description to indicate the same or similar elements.

DETAILED DESCRIPTION

When an optical technique (e.g., a laser technique) is used to singulatea semiconductor package structure having transparent material(s) (e.g.,a transparent carrier and/or a transparent insulation layer), analignment used in the optical technique may fail because scribe lines ofthe semiconductor package structure may not be correctly detected orrecognized due to the transparent material(s).

In some embodiments of the subject application, an opaque ornon-transparent material/layer is disposed on scribe lines of a glasscarrier/panel/plate during manufacture of a semiconductor packagedevice, and a portion of such an opaque or non-transparentmaterial/layer remains in the vicinity of (or close to/adjacent to) asidewall/edge of the semiconductor package device subsequent to asingulation/dicing/cutting/separation operation. The opaque ornon-transparent material/layer may improve the alignment when an opticalsingulation technique is applied.

FIG. 1A illustrates a cross-sectional view of a semiconductor packagedevice 1 a in accordance with some embodiments of the subjectapplication. The semiconductor package device 1 a includes a transparentcarrier 10, patterned conductive layers 20, 50, 51 and 60, insulationlayers 30, 40 and 61, a metal layer 62, and an adhesive material 70.

The transparent carrier 10 has a surface 101. The transparent carrier 10has a surface 102 opposite the surface 101. The transparent carrier 10has a surface 10 s (e.g. a side or lateral surface) extended between thesurface 101 and the surface 102. The transparent carrier 10 may includeglass or other transparent materials. The transparent carrier 10 mayfunction as a substrate for the semiconductor package device 1 a. Thetransparent carrier 10 may reduce electrical leakage or insertion lossfor the semiconductor package device 1 a.

The patterned conductive layer 60 is disposed on the surface 101 of thetransparent carrier 10. The patterned conductive layer 60 iselectrically isolated from the patterned conductive layer 20. In someembodiments of the subject application, the patterned conductive layer60 may be part of an integrated passive device (IPD). In someembodiments of the subject application, the patterned conductive layer60 may be part of a metal-insulation-metal (MIM) structure. For example,in the embodiment shown in FIG. 1A, the insulation layer 61, the metallayer 62, and the patterned conductive layer 60 may form an IPD or anMIM structure. The patterned conductive layer 60 may include gold (Au),silver (Ag), aluminum (Al), copper (Cu), or an alloy thereof.

The insulation layer 30 is disposed on the transparent carrier 10. Theinsulation layer 30 is disposed on at least a portion of the patternedconductive layer 60. The insulation layer 30 covers at least a portionof the patterned conductive layer 60. The insulation layer 30 mayinclude transparent material. The insulation layer 30 may betransparent. The insulation layer 30 may include a passivation material.The insulation layer 30 may include a dielectric material.

A patterned conductive layer 51 is disposed on the insulation layer 30.The patterned conductive layer 51 may be electrically connected to themetal layer 62. The patterned conductive layer 51 may be aredistribution layer (RDL). The patterned conductive layer 51 mayinclude gold (Au), silver (Ag), aluminum (Al), copper (Cu), or an alloythereof. The patterned conductive layer 50 is disposed on the patternedconductive layer 51. The patterned conductive layer 50 is electricallyisolated from the patterned conductive layer 20. The patternedconductive layer 50 and the patterned conductive layer 51 may constitutean under bump metallurgy (UBM) structure. The patterned conductive layer50 may include gold (Au), silver (Ag), aluminum (Al), copper (Cu), or analloy thereof.

The patterned conductive layer 20 is disposed on the surface 101 of thetransparent carrier 10. The patterned conductive layer 20 has a surface20 s coplanar with the surface 10 s of the transparent carrier 10. Thepatterned conductive layer 20 is disposed on the insulation layer 30. Asidewall 30 s of the insulation layer 30 is covered by the patternedconductive layer 20. The patterned conductive layer 20 may have a “Z”shape (e.g. may include two portions that extend horizontally, that areoffset from each other (e.g. do not vertically project on each other),and that are connected by a third vertical portion). The patternedconductive layer 20 may include opaque or non-transparent material. Thepatterned conductive layer 20 may be opaque or non-transparent. Thepatterned conductive layer 20 may include the same material as thepatterned conductive layer 50. The patterned conductive layer 20 and thepatterned conductive layer 50 may be formed concurrently, or may beintegrally formed. In some embodiments of the subject application, thepatterned conductive layer 20 is electrically isolated from otherconductive elements/layers within the semiconductor package device 1 a(e.g. from all other conductive elements/layers explicitly describedherein).

The insulation layer 40 is disposed on the insulation layer 30. Theinsulation layer 40 is disposed on the patterned conductive layer 50.The insulation layer 40 is disposed on the patterned conductive layer20. The insulation layer 40 covers at least a portion of the patternedconductive layer 20. A sidewall 40 s of the insulation layer 40 isnon-coplanar with the surface 20 s of the patterned conductive layer 20.The patterned conductive layer 20 has a surface 201 connected to thesurface 20 s (e.g. substantially perpendicular to and connected to thesurface 20 s). The surface 201 of the patterned conductive layer 20 isexposed from the insulation layer 40. The insulation layer 40 covers thepatterned conductive layer 51. The insulation layer 40 covers at least aportion of the patterned conductive layer 50. A surface 501 of thepatterned conductive layer 50 is exposed from the insulation layer 40.The insulation layer 40 may include a transparent material. Theinsulation layer 40 may be transparent. The insulation layer 40 mayinclude passivation material. The insulation layer 40 may includedielectric material.

The adhesive material 70 is disposed on the surface 102 of thetransparent carrier 10. The adhesive material 70 may include atransparent material. The adhesive material 70 may include adie-attach-film (DAF). The adhesive material 70 may be used to attachthe semiconductor package device 1 a to another device or circuit board.

FIG. 1B illustrates a cross-sectional view of a semiconductor packagedevice 1 b in accordance with some embodiments of the subjectapplication. The semiconductor package device 1 b is similar to thesemiconductor package device 1 a, but has at least the followingdifferences.

The surface 40 s of the insulation layer 40 is coplanar with the surface20 s of the patterned conductive layer 20 and the surface 10 s of thetransparent carrier 10. The exposed surface 201 of the patternedconductive layer 20 in the semiconductor package device 1 a is coveredby the insulation layer 40 in the semiconductor package device 1 b.

FIG. 2A illustrates a cross-sectional view of a semiconductor packagedevice 2 a in accordance with some embodiments of the subjectapplication. The semiconductor package device 2 a is similar to thesemiconductor package device 1 a, but has at least the followingdifferences.

The insulation layer 30 is disposed on the patterned conductive layer20. The insulation layer 30 covers a portion of the patterned conductivelayer 20. The sidewall 30 s of the insulation layer 30 is covered by theinsulation layer 40. The patterned conductive layer 20 is coplanar withthe patterned conductive layer 60. The patterned conductive layer 20 andthe patterned conductive layer 60 may include a same material. Thepatterned conductive layer 20 and the patterned conductive layer 60 maybe formed concurrently, or may be integrally formed.

FIG. 2B illustrates a cross-sectional view of a semiconductor packagedevice 2 b in accordance with some embodiments of the subjectapplication. The semiconductor package device 2 b is similar to thesemiconductor package device 2 a, but has at least the followingdifferences.

The surface 40 s of the insulation layer 40 is coplanar with the surface20 s of the patterned conductive layer 20 and the surface 10 s of thetransparent carrier 10. The exposed surface 201 of the patternedconductive layer 20 in the semiconductor package device 2 a is coveredby the insulation layer 40 in the semiconductor package device 2 b.

FIG. 3A, FIG. 3B, FIG. 3C, FIG. 3D, FIG. 3E, FIG. 3F, FIG. 3G, FIG. 3H,FIG. 3I and FIG. 3J show operations for manufacturing a semiconductorpackage device 3 j in accordance with some embodiments of the subjectapplication.

Referring to FIG. 3A, a patterned conductive layer 60 is formed on atransparent carrier 10 a. An insulation layer 61 is formed on thepatterned conductive layer 60. A metal layer 62 is formed on theinsulation layer 61. The patterned conductive layer 60, the insulationlayer 61 and the metal layer 62 may form an IPD or an MIM structure. Thepatterned conductive layer 60 may be an electrode of an electroniccomponent. The patterned conductive layer 60 may be formed by, forexample, but not limited to, a plating operation.

Referring to FIG. 3B, an insulation layer 30 is formed on thetransparent carrier 10 a. The insulation layer 30 is formed on thepatterned conductive layer 60. The insulation layer 30 may be formed by,for example, but not limited to, a coating, a printing or a screeningoperation. An opening O1 is formed in the insulation layer 30 to exposethe metal layer 62. A space S1 is formed in the insulation layer 30 toexpose the transparent carrier 10 a. The portion of the transparentcarrier 10 a exposed to the space S1 includes scribe lines forsingulation. The opening O1 and the space S1 may be formed by, forexample, but not limited to, an etching and/or a lithographic operation.

Referring to FIG. 3C, a patterned conductive layer 51 is formed on theinsulation layer 30. The patterned conductive layer 51 may be formed by,for example, but not limited to, a plating operation. The patternedconductive layer 51 may include an RDL structure.

Referring to FIG. 3D, a patterned conductive layer 50 is formed on thepatterned conductive layer 51. The patterned conductive layer 50 may beformed by, for example, but not limited to, a plating operation. Thepatterned conductive layer 50 and the patterned conductive layer 51 mayform a UBM structure. A patterned conductive layer 20 is formed on theinsulation layer 30. The patterned conductive layer 20 is formed on thetransparent carrier 10 a. The patterned conductive layer 20 is formed onthe scribe lines of the transparent carrier 10 a. The patternedconductive layer 20 and the patterned conductive layer 51 may be formedconcurrently, or may be integrally formed. The patterned conductivelayer 20 and the patterned conductive layer 51 may be formed by a sameoperation. The patterned conductive layer 20 may be electricallyisolated from the patterned conductive layers 60, 51 and 50.

Referring to FIG. 3E, an insulation layer 40 is formed on the insulationlayer 30. The insulation layer 40 covers the patterned conductive layer20 and the patterned conductive layer 50. An etching operation isperformed to expose a surface 501 of the patterned conductive layer 50from the insulation layer 40. An etching operation is performed toexpose a surface 201 of the patterned conductive layer 20 from theinsulation layer 40.

Operations shown in FIG. 3F, FIG. 3G and FIG. 3H may constitute a dicingbefore grinding (DBG) operation. Referring to FIG. 3F, a dicing or ahalf cut operation is performed along the scribe line of the transparentcarrier 10 a to form a trench 80 through the patterned conductive layer20 and into the transparent carrier 10 a.

Referring to FIG. 3G, a protection tape P1 is attached to the structureof FIG. 3F. The protection tape P1 may be attached by a laminationoperation.

Referring to FIG. 3H, a grinding operation is performed to remove aportion of the transparent carrier 10 a. A plurality of singulatedtransparent carriers 10 are formed.

Referring to FIG. 3I, the plurality of singulated transparent carriers10 are attached to an adhesive layer 70 a. The protection tape P1 isremoved. The adhesive layer 70 a may include a die attach film (DAF).

Referring to FIG. 3J, the adhesive layer 70 a is singulated into aplurality of adhesive layers 70. The singulation operation may beperformed by an optical operation, such as a laser operation. Thepatterned conductive layer 20 may function as an alignment mark for thesingulation operation. The alignment of the laser operation may be basedon the patterned conductive layer 20. A semiconductor package device 3 jis formed. The semiconductor package device 3 j may be similar to or thesame as the semiconductor package device 1 a in FIG. 1A. If the dicingoperation in FIG. 3F is performed with a wide blade, the semiconductorpackage device 3 j in FIG. 3J may be similar to or the same as thesemiconductor package device 1 b in FIG. 1B.

FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4F, FIG. 4G, FIG. 4H,FIG. 4I and FIG. 4J show operations for manufacturing a semiconductorpackage device 4 j in accordance with some embodiments of the subjectapplication.

Referring to FIG. 4A, the operations shown in FIG. 4A are similar to theoperations shown in FIG. 3A except that a patterned conductive layer 20is additionally formed on the transparent carrier 10 a. The patternedconductive layer 20 is formed on a scribe line of the transparentcarrier 10 a. The patterned conductive layer 20 and the patternedconductive layer 60 may be formed concurrently, or may be integrallyformed. The patterned conductive layer 20 and the patterned conductivelayer 60 may be formed by a same operation.

Referring to FIG. 4B, the operations shown in FIG. 4B are similar to theoperations shown in FIG. 3B except that the insulation layer 30 isadditionally formed on the patterned conductive layer 20, and the spaceS1 is formed in the insulation layer 30 to expose the patternedconductive layer 20.

Referring to FIG. 4C, the operations shown in FIG. 4C are the same asthe operations shown in FIG. 3C. A patterned conductive layer 51 isformed on the insulation layer 30.

Referring to FIG. 4D, a patterned conductive layer 50 is formed on thepatterned conductive layer 51. The patterned conductive layer 50 may beformed by, for example, but not limited to, a plating operation. Thepatterned conductive layer 50 and the patterned conductive layer 51 mayform a UBM structure. The patterned conductive layers 60, 51 and 50 maybe electrically isolated from the patterned conductive layer 20.

Referring to FIG. 4E, an insulation layer 40 is formed on the insulationlayer 30. The insulation layer 40 covers the patterned conductive layer20 and the patterned conductive layer 50. An etching operation isperformed to expose a surface 501 of the patterned conductive layer 50from the insulation layer 40. An etching operation is performed toexpose a surface 201 of the patterned conductive layer 20 from theinsulation layer 40.

Operations shown in FIG. 4F, FIG. 4G and FIG. 4H may be referred to as adicing before grinding (DBG) operation. Referring to FIG. 4F, a dicingor a half cut operation is performed along the scribe line of thetransparent carrier 10 a to form a trench 80 through the patternedconductive layer 20 and into the transparent carrier 10 a.

Referring to FIG. 4G, a protection tape P1 is attached to the structureof FIG. 4F. The protection tape P1 may be attached by a laminationoperation.

Referring to FIG. 4H, a grinding operation is performed to remove aportion of the transparent carrier 10 a. A plurality of singulatedtransparent carriers 10 are formed.

Referring to FIG. 4I, the plurality of singulated transparent carriers10 are attached to an adhesive layer 70 a. The protection tape P1 isremoved. The adhesive layer 70 a may include a die attach film (DAF).

Referring to FIG. 4J, the adhesive layer 70 a is singulated into aplurality of adhesive layers 70. The singulation operation may beperformed by an optical operation, such as a laser operation. Thepatterned conductive layer 20 may function as an alignment mark for thesingulation operation. The alignment of the laser operation may be basedon the patterned conductive layer 20. A semiconductor package device 4 jis formed. The semiconductor package device 4 j may be similar to or thesame as the semiconductor package device 2 a in FIG. 2A. Note that, ifthe dicing operation in FIG. 4F is performed with a wide blade, thesemiconductor package device 4 j in FIG. 4J may be similar to or thesame as the semiconductor package device 2 b in FIG. 2B.

As used herein, the term “transparent” may refer to a material having atransmittance of about 50% or more, about 70% or more, or about 90% ormore for a light to which the material is exposed. The term “opaque” mayrefer to a material having a transmittance of less than about 50%, lessthan about 30%, or less than about 10% for a light to which the materialis exposed.

As used herein, the terms “approximately,” “substantially,”“substantial” and “about” are used to describe and account for smallvariations. When used in conjunction with an event or circumstance, theterms can refer to instances in which the event or circumstance occursprecisely as well as instances in which the event or circumstance occursto a close approximation. For example, when used in conjunction with anumerical value, the terms can refer to a range of variation less thanor equal to ±10% of that numerical value, such as less than or equal to±5%, less than or equal to ±4%, less than or equal to ±3%, less than orequal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%,less than or equal to ±0.1%, or less than or equal to ±0.05%. Forexample, two numerical values can be deemed to be “substantially” or“about” the same if a difference between the values is less than orequal to ±10% of an average of the values, such as less than or equal to±5%, less than or equal to ±4%, less than or equal to ±3%, less than orequal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%,less than or equal to ±0.1%, or less than or equal to ±0.05%. Forexample, “substantially” perpendicular can refer to a range of angularvariation relative to 90° that is less than or equal to ±10°, such asless than or equal to ±5°, less than or equal to ±4°, less than or equalto ±3°, less than or equal to ±2°, less than or equal to ±1°, less thanor equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to±0.05°.

Two surfaces can be deemed to be coplanar or substantially coplanar if adisplacement between the two surfaces is no greater than 5 μm, nogreater than 2 μm, no greater than 1 μm, or no greater than 0.5 μm. Asurface can be deemed to be planar or substantially planar if adifference between a highest point and a lowest point of the surface isno greater than 5 μm, no greater than 2 μm, no greater than 1 μm, or nogreater than 0.5 μm.

As used herein, the singular terms “a,” “an,” and “the” may includeplural referents unless the context clearly dictates otherwise. In thedescription of some embodiments, a component provided “on” or “over”another component can encompass cases where the former component isdirectly on (e.g., in physical contact with) the latter component, aswell as cases where one or more intervening components are locatedbetween the former component and the latter component.

While the subject application has been described and illustrated withreference to specific embodiments thereof, these descriptions andillustrations do not limit the subject application. It can be clearlyunderstood by those skilled in the art that various changes may be made,and equivalent components may be substituted within the embodiments,without departing from the true spirit and scope of the subjectapplication as defined by the appended claims. The illustrations may notnecessarily be drawn to scale. There may be distinctions between theartistic renditions in the subject application and the actual apparatus,due to variables in manufacturing processes and such. There may be otherembodiments of the subject application which are not specificallyillustrated. The specification and drawings are to be regarded asillustrative rather than restrictive. Modifications may be made to adapta particular situation, material, composition of matter, method, orprocess to the objective, spirit and scope of the subject application.All such modifications are intended to be within the scope of the claimsappended hereto. While the methods disclosed herein have been describedwith reference to particular operations performed in a particular order,it can be understood that these operations may be combined, sub-dividedor re-ordered to form an equivalent method without departing from theteachings of the subject application. Therefore, unless specificallyindicated herein, the order and grouping of the operations are notlimitations of the subject application.

1. A semiconductor package device, comprising: a transparent carrierhaving a first surface, a second surface opposite to the first surfaceand a third surface extended between the first surface and the secondsurface; a first patterned conductive layer disposed on the firstsurface of the transparent carrier, the first patterned conductive layerhaving a first surface coplanar with the third surface of thetransparent carrier; a second patterned conductive layer disposed on thefirst surface of the transparent carrier and electrically isolated fromthe first patterned conductive layer; and a first insulation layerdisposed on the transparent carrier and covering the first patternedconductive layer.
 2. The semiconductor package device of claim 1,wherein the first insulation layer has a sidewall non-coplanar with thefirst surface of the first patterned conductive layer, and the firstpatterned conductive layer has a second surface connected to the firstsurface of the first patterned conductive layer and exposed from thefirst insulation layer.
 3. The semiconductor package device of claim 1,wherein the first insulation layer has a sidewall coplanar with thefirst surface of the first patterned conductive layer.
 4. Thesemiconductor package device of claim 1, further comprising a secondinsulation layer disposed between the transparent carrier and the firstinsulation layer and having a sidewall, wherein the sidewall of thesecond insulation layer is covered by the first patterned conductivelayer.
 5. (canceled)
 6. The semiconductor package device of claim 4,wherein the second insulation layer comprises a transparent material. 7.The semiconductor package device of claim 1, wherein the firstinsulation layer comprises a transparent material.
 8. The semiconductorpackage device of claim 1, wherein the first patterned conductive layerand the second patterned conductive layer comprise a same material. 9.The semiconductor package device of claim 1, further comprising anadhesive material on the second surface of the transparent carrier, theadhesive material comprising a transparent material.
 10. Thesemiconductor package device of claim 4, wherein the second patternedconductive layer is disposed on the second insulation layer and coveredin part by the first insulation layer, and a surface of the secondpatterned conductive layer is exposed from the first insulation layer.11. The semiconductor package device of claim 1, wherein the secondpatterned conductive layer is coplanar with the first patternedconductive layer.
 12. A semiconductor package device, comprising: atransparent carrier having a first surface, a second surface opposite tothe first surface and a third surface extended between the first surfaceand the second surface; a first patterned conductive layer disposed onthe first surface of the transparent carrier, the first patternedconductive layer having a first surface coplanar with the third surfaceof the transparent carrier; and a first transparent insulation layerdisposed on the transparent carrier and covering the first patternedconductive layer.
 13. The semiconductor package device of claim 12,wherein the first transparent insulation layer has a sidewallnon-coplanar with the first surface of the first patterned conductivelayer, and the first patterned conductive layer has a second surfaceconnected to the first surface of the first patterned conductive layerand exposed from the first transparent insulation layer.
 14. Thesemiconductor package device of claim 12, wherein the first transparentinsulation layer has a sidewall coplanar with the first surface of thefirst patterned conductive layer.
 15. The semiconductor package deviceof claim 12, further comprising a second transparent insulation layerdisposed between the transparent carrier and the first transparentinsulation layer, wherein a sidewall of the second transparentinsulation layer is covered by the first patterned conductive layer. 16.(canceled)
 17. The semiconductor package device of claim 12, furthercomprising an adhesive material on the second surface of the transparentcarrier, the adhesive material comprising a transparent material. 18.The semiconductor package device of claim 15, further comprising asecond patterned conductive layer disposed on the first surface of thetransparent carrier and electrically isolated from the first patternedconductive layer.
 19. (canceled)
 20. (canceled)
 21. (canceled) 22.(canceled)
 23. The semiconductor package device of claim 1, wherein thesecond patterned conductive layer is part of an integrated passivedevice (IPD) disposed between the transparent carrier and the firstinsulation layer.
 24. The semiconductor package device of claim 18,wherein the first patterned conductive layer and the second patternedconductive layer comprise a same material.
 25. The semiconductor packagedevice of claim 18, wherein the second patterned conductive layer isdisposed on the second transparent insulation layer and covered by thefirst transparent insulation layer, and a surface of the secondpatterned conductive layer is exposed from the first transparentinsulation layer.
 26. The semiconductor package device of claim 18,wherein the second patterned conductive layer is part of an integratedpassive device (IPD) disposed between the transparent carrier and thefirst transparent insulation layer.